|
Solder Bump Experts| The following experts are available as solder bump consultants and solder bump expert witnesses. Intota experts are peer-recommended authorities who have been carefully selected and rigorously screened. | |
| | Definition: Solder Bump -
Solder in the form of a ball used to make interconnections between a flip-chip component and a base material during controlled-collapse soldering. |
|
|
| 1 to 2
(of 2) | | | | Request Free
Expert Quote | | |  | | Expert in Electronics Assembly, Soldering Technology, Fluxes, Cleaning Systems
Expert's background has been in electronics fabrication since 1978. Under the heading of "Soldering Technology" he has been involved with the development and assessment of electronic production lines from the simplest single-sided to multilayer printed ... See full profile | | Alabama (AL), USA  | | | | | | Expert in IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling
Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC ... See full profile | | California (CA), USA | | |  |
|
| |
|
