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multichip module

  

electronic assembled device

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ceramic multichip module

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multichip module application

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multichip module substrate

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multichip module packaging process

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multichip module cooling

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chip on board assembly

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integrated-circuit packaging process

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integrated circuit

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electronic packaging technology

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known good die

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low-temperature cofired ceramic

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printed circuit board

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semiconductor device packaging process

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application-specific integrated circuit

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electronic module

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printed circuit

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hybrid integrated circuit

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electronic packaging industry

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thin small outline package

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printed board assembly

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radio-frequency power amplifier

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ball grid array package

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diamond-like carbon

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ceramic component manufacturing

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Multichip Module Experts

The following experts are available as multichip module consultants and multichip module expert witnesses.  Intota experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Multichip Module - An electronic assembled device that may combine a variety of application-specific integrated circuits on a common substrate. Placed in close proximity on a single, optimized surface, the chips communicate much faster with each other than they would on a conventional printed circuit board.

Synonyms:  MCM, multi-chip module

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Expert in Microelectronic Packaging, Capacitors, Resistors, Inductors, Decoupling, Circuit Boards, Materials
Expert graduated with his PhD in Chemical Engineering in 1983 from the University of Texas at Austin. He then worked at Texas Instruments' Advanced Packaging Laboratory designing gas phase reactors, and at Radian Corporation writing computer models of ... See full profile

Arkansas (AR), USA

Expert in Semiconductor Industry IC Package Design and Development, Consulting and Training
Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert ... See full profile

California (CA), USA

Expert in Electronic Assembly, Electronic Packaging
Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) ... See full profile

California (CA), USA

Expert in Electronic Packaging and Materials
Expert has spent a portion of the past 10 years on improving the efficiency of multi-junction amorphous silicon solar cells. In particular, a large effort has been directed at understanding metal-induced crystallization of amorphous ... See full profile

Arkansas (AR), USA

Expert in Microvias, Blind Microvia Laser Drilling, Circuit Board Fabrication
Expert's entire career has been devoted to developing, introducing, and managing advanced circuit board technology, including activities within the circuit board design environment. He is currently introducing 0.008 inch, 0. See full profile

Oregon (OR), USA

Expert in Electronic Components: System Reliability, and Failure Analysis
Expert notes that active electronic elements such as transistors, diodes, integrated circuits, ASICs, MMICs, hybrid microelectronic devices, and MCMs are the basis for all electronic systems. Expert's depth of knowledge ... See full profile

Arizona (AZ), USA

Expert in Surface Mount Technology
Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. See full profile

New Hampshire (NH), USA

Expert in Photo Imaging of Printed Circuit Boards
Expert is a seasoned professional with over 30 years experience in the printed circuit board manufacturing environment. He is a results oriented person with proven expertise as a process engineer and manager. He has strong project management, ... See full profile

Ohio (OH), USA

Expert in Web Development, Database Driven Wrb Applications dDvelopment, Yahoo! Stores and Ecommerce Solutions
Expert has spent the past 20 years in engineering of surface mount technology (SMT) and hybrid microelectronics. He has concentrated on automated assembly and design for manufacturability. He founded AMTI (The Advanced ... See full profile

Massachusetts (MA), USA

Expert in Thin Films, Vacuum Technology, thin film resistors, semiconductor processing
Expert has over 25 years experience in all areas of physical vapor deposition. He is experienced in vacuum and sputter deposition, as well as reactive and diode sputtering. He heads a company offering services and manufacturing in this area, ... See full profile

New York (NY), USA

Expert in Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis
Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use ... See full profile

Maryland (MD), USA

Expert in Vacuum Processes, Optical Multilayer Thin Films, Ophthalmic Lenses, Photochromic Dyes, Diamond film
Thin film, high vacuum, thin-film deposition process. Expert has expertise in many aspects of thin film deposition processes including physical vapor deposition, rf and dc magnetron sputtering, ion beam sputtering, ... See full profile

Minnesota (MN), USA

Expert in Material and Process Technology Transfer
Electronic materials & processes; printed circuit board manufacturing. Expert is heavily involved in the printed circuit board manufacturing field, with emphasis on cermet and polymer thick films, electronic polymers and solid state ... See full profile

New York (NY), USA

Expert in Materials, Processes and Hermeticity Testing of Microelectronics for Aerospace and Medical Implants
He has demonstrated expertise in hermetic sealing and leak testing processes for cavity style packaged microcircuits intended for high reliability military, aerospace and Class III medical implants. He has worked as a hermeticity consultant for prominent ... See full profile

Pennsylvania (PA), USA

Expert in Technical Marketing, New Product Development & Launch, Materials Physics
Heat transfer across interfaces and through particulate-filled composite materials (solids and liquids) was one of his primary areas of research while at 3M Company. His work included development of heat transfer products for use in electronic equipment ... See full profile

Minnesota (MN), USA

Expert in Technical Ceramics Synthesis, Powder Processing, Compacting and Sintering/reaction Bonding
Expert has over 30 years of experience in the industry. His areas of expertise include materials such as: Carbides, Nitrides, Sialons, Combustion Synthesis, Powder Processing, Sintering, and Reaction Bonding. Expert has provided experience with Research, ... See full profile

Ohio (OH), USA

Expert in Surface Mount Technology (SMT) and High-Technology Light Sources, Turnkey Operations, etc.
Expert has devoted a significant portion of his career to the development of Surface Mount Technology (SMT) devices, equipment, and processes. These include: placement, cleaning, solder reflow equipment, components, component design, ... See full profile

New York (NY), USA

Expert in IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling
Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC ... See full profile

California (CA), USA

Expert in Power Semiconductor Devices
Expert has spent a significant portion of his career in the design, fabrication, and application of power transistors. He is an expert in the reliability aspects of power transistors. He teaches a graduate-level course in ... See full profile

Arkansas (AR), USA

Expert in Materials for Electronic Applications
Expert has successfully writen 2 proposals for EPA SBIR grants. The first was for a phase 1 program for the recovery and regeneration of spent etchants. This successful program was followed by a phase 2 proposal and award. That phase 2 program is in ... See full profile

California (CA), USA

Expert in Electroplating, Electroless Plating
Electroless nickel plating; nickel electroplating process. Expert has experience in research and development of electroless nickel plating products and processes. He has studied electroless nickel plating on zinc die castings, ... See full profile

Washington (WA), USA

Expert in Semiconductor fabrication, packaging, laser processing, Reliability, fuse redundancy
Expert has his doctorate from the world's top research university with over 20 years experience in semiconductor device fabrication and manufacturing. He has several patents related to laser processing of application specific circuitry and ... See full profile

Israel

Expert in Electronic Components Manufacturing, Marketing and Sales
Expert has over 40 years of experience in design, development, marketing and sales of a full range of active electronic components. He was in sales when microprocessors were first launched and now he is in Solid State Lighting as that becomes a ... See full profile

Bucks, United Kingdom

Expert in Surface Technology, Coatings, Thin Film Deposition, PVD, Physical Vapour Deposition, Sputtering, PLD
He studied materials science with a focus on thin film materials, focussing in his PhD on process equipment and design of room-temperature deposited coating. As post-doc, he was employed to scale up deposition process from laboratory to industrially ... See full profile

Austria

Expert in Thermal Processing of Advanced Materials.
He has extensive experience with the removal of binder systems from ceramic systems during post-processing, including safety, code compliance and practical aspects. Binders worked with range from "classic" organic binders to "catalytic" binders (e.g. See full profile

Pennsylvania (PA), USA

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