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Flip-Chip Assembly Experts| The following experts are available as flip-chip assembly consultants and flip-chip assembly expert witnesses. Intota experts are peer-recommended authorities who have been carefully selected and rigorously screened. | |
| | Definition: Flip-Chip Assembly -
Assembly of a flip chip in which the flip chip is face-bonded to a substrate through raised bumps, either solder or precious metal. Synonyms: flip bonding |
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Expert Quote | | |  | | Expert in Technical Marketing, New Product Development & Launch, Materials Physics
Heat transfer across interfaces and through particulate-filled composite materials (solids and liquids) was one of his primary areas of research while at 3M Company. His work included development of heat transfer products for use in electronic equipment ... See full profile | | Minnesota (MN), USA  | | | |  | | Expert in Soldering Technology, Printed Circuit Boards, Intermetallic Compounds and Military Standard-2000
Expert's career has provided him with the opportunity to see and be a part of the growth of the electronics industry from vacuum tubes and terminals to transistors and printed wiring boards. His early working life was spent as lead laboratory engineer ... See full profile | | Alabama (AL), USA | | | |  | | Expert in Soldering, Cleaning, Surface Mounting, PCBs
Expert has expertise in all aspects of soldering. His knowledge originally developed during his six years as Staff Metallurgist at IBM, where he was in charge of soldering and metal joining for the product development labs. See full profile | | New Jersey (NJ), USA | | |  |
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