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 Expert  727799

Expert in IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling


Available for your Consulting and Expert Witness Needs

California (CA)
USA
Education Work History Career AccomplishmentsPublicationsConsulting Services Expert Witness

Summary of Expertise: Listed with other top experts in: 
Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC substrate manufacturing. He interfaced with plating solution and equipment suppliers, as well as substrate manufacturers, to push the state of the art for both electroless and electrolytic copper plating. His work involved selection and implementation of new unfilled and filled via plating chemstries, periodic reverse pulse plating equipment, jet plating equipment, and continuous plating equipment for panel-level plating. His work also included periodic troubleshooting of high volume manufacturing lines to resolve electrolytic plating issues, which included bubble entrapment, via delamination, and large dimple formation, as well as electroless plating issues such as incomplete via coverage, thickness non-uniformity across the panel, and foreign material induced quality issues.
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copper metallizing

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interconnect substrate

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metal organic chemical vapor deposition

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printed circuit board substrate

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surface finishing process


Show Secondary and Basic Areas of Expertise
Localities:
Expert may consult nationally and internationally, and is also local to the following cities: Los Angeles, California;  San Diego, California;  Long Beach, California;  Santa Ana, California;  Anaheim, California;  Riverside, California;  Glendale, California;  Huntington Beach, California;  San Bernardino, California;  and Chula Vista, California.

Often requested
with this expert:

Magnetron Cathode Design, Magnetic Field Modeling, PVD,...
Thin Film Science and Technology
Surface Mount Technology (SMT) and High-Technology Light...
Electronic Reliability & On-Chip ESD Protection

Education:
Year   Degree   Subject   Institution  
2004   PhD   Chemical Engineering   University of Florida  
1997   Bachelor's   Chemical Engineering   Georgia Institute of Technology  

Work History:
Years   Employer   Department   Title  

2008 to

 

(Undisclosed)

 

Expert's Firm CDMA Technologies (QCT)

 

Senior Staff Engineer

 

2004 to 2008

 

Intel Corporation

 

Assembly Test Technology Development

 

Senior Packaging Engineer

 

1999 to 2004

 

University of Florida

 

Department of Chemical Engineering

 

UF Alumni Graduate Fellow

 

1997 to 1999

 

Fluor Daniel

 

Petroleum and Petrochemicals

 

Associate Process Engineer II

 

Career Accomplishments:
Associations/Societies

-iNEMI -iMAPS -AICHE

Professional Appointments

-Former co-chair of iNEMI surface finish consortium (2007-2008) -Session chair for iMAPs "Think Thin" workshop (August 2011)

Awards/Recognition

-Invited guest lecturer to ASU's Introduction to Microelectronic Packaging Course (2005) -Invited speaker at Intel/Halogen Free Symposium (2008)


Publications:
Publications and Patents Summary

He has 8 patents, 18 patent applications under consideration by the USPTO, and over 10 publications.

Selected Publications and Publishers  
 - 2011 Electronic Componenents Technology Conference  
 - Intel Technology Journal  
 - Journal of the American Chemical Society  
 - Journal of the Electrochemical Society  

Consulting Services:
Recent Client Requests:
  • Expert in Precursors.
  • Expert in PTC Thermistor to assist with Gold Bonding and yield issues.
Click the green button above to contact Expert for a free initial screening call regarding your expert consulting needs.  Expert is available for consulting to corporate, legal and government clients.  Remember, your initial screening call to speak with Expert is free.

Expert Witness:
Click the green button above to contact Expert for a free initial screening call regarding expert testimony, litigation consulting and support, forensic services, or any related expert witness services.  A few litigation needs include product liability, personal injury, economic loss, intellectual property (patent, trademark, trade secret, copyright), and insurance matters.  Remember, your initial screening call to speak with Expert is free.

International Experience:
Years   Country / Region   Summary
2008 to 2011   Asia-Pacific   He defines the substrate technology roadmap for a Fortune 500 company, and is driving substrate manufacturing technology upgrades and implementation to production at a number of substrate manufacturing sites in Asia. He also drives assembly material selection and process improvements at a number of large asubcontractor sites in Asia.
2004 to 2008   Japan   Working with major FCBGA/FCPGA/FCLGA substrate suppliers, he drove implementation of new ENEPIG surface finish onto substrates used in HVM by a major worldwide semiconductor producer. He also drove technology development for copper plating (to improve thickness uniformity), led halogen-free substrate materials selection and implementation, and led a warpage improvement effort for said major worldwide semiconductor producer.

Language Skills:
Foreign Language   Description
French   He can speak, read and write French at an intermediate level, having studied for 4 years in high school and 1 year at University level.
Portuguese   He can speak, read and write Brazilian Portuguese at a beginner level, having traveled substantially to Brazil from 2002 to present day.

 

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