2006 to

(Undisclosed Consulting Company)

(Undisclosed Consulting Company)

·Independent Consulting in IC Packaging design and development, Electrical Analysis ·Material selection for Packaging Materials, including Substrates, Die Adhesives, Encapsulation, Interconnection ·Vendor sourcing and interaction for product development

2004 to 2006

Meggitt Electronics Endevco

Systems Engineering

Project Engineering Manager

·She managed the development team including packaging, materials, electrical, mechanical, and software engineers ·She coordinated and led product development within Stage Gate Process, troubleshooting, and testing of new systems for smart sensors, MEMs, MOEMs using Six Sigma/DOE principles ·Ensured proper transition of new products to Integration and Manufacturing Engineering

1999 to 2004

Conexant Systems Inc.

IC Packaging and Assembly

Principal Packaging Engineer

·Managed several projects with cross-functional teams from IC design to package manufacturing, test and reliability to achieve cost reduction on wafer and package level and improve the technology. ·Developed design guidelines and product package roadmaps, aligning business needs with technical advancements ·Assessed emerging technologies (Flip Chip, stacked die, scribe line reduction). ·Developed new packages introducing new product design rules for the company's next generation of RF-IC products (e.g. world's smallest Power Amplifiers, LNAs, and Bluetooth). Worked closely with substrate and assembly manufacturers and cross-functional teams ·Performed electrical analysis of IC packages in Simultaneous switching noise, IBIS modeling, and parasitic analysis ·Reviewed package layouts for all advanced packages from Leadframe, RF-LGA and Multichip Modules to high I/O Ball Grid Array. ·Consulted different divisions for package selection, product design and design analysis prior to and post layout, input on cost, material and technology, gave workshops on Advance Packaging technologies

1995 to 1999

FRAUNHOFER INSTITUTE IN BERLIN – GERMANY

Multichip Modules

Head of Department

Managed a group of 19 scientists/engineers. Led projects within Package Design, RF modeling and simulation, EMC/EMI analysis, HF measurement and test, and software development. Coordinated the priorities, schedules and budgets for the Research and Engineering. Worked in research and development of advanced IC packages. ·Used Ansoft HFSS, Q3D/Q2D, PSPICE/HSPICE. ·Authored numerous chapters in the books: Direct Attachment of ICs (German, Editor Prof. Reichl) and EMC Cookbook for PCBs (German).

1987 to 1994

Technical University of Berlin

Microperipherik

Research Associate

Worked towards PH.D in Package Electrical Analysis, wrote a software program to support package design and SI analysis.

• Package substrate design expert for consulting on package and substrate design.
• Expert in design critea for electronics made on ceramic substrate.
• Expert for consulting on Soleniod Valve project has encountered problems.
• Expert in Carbon Ink Printed Circuit Boards.
• Expert in circuit board developer for consulting on fireplace.