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Expert in Semiconductor Industry IC Package Design and Development, Consulting and Training
Available for your Consulting and Expert Witness Needs
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Summary of Expertise:
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Listed with other top experts in: |
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Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers
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Expert has Ph.D. in analyzing interconnection technologies, including High-speed packaging, circuit simulation, HF simulation, electromagnetic simulation, crosstalk.
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Expert has over 20 years of experience in design, development and analysis of IC packaging, including multichip modules, system in packages, leadless chip carriers, leadframe packages
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Expert has over 20 years of experience in design, development and analyzing of electronic packages particularly multichip modules/system in packages, ball grid arrays, land grid arrays
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Expert has been involved in all steps of packaging and PCB substrate development including defining design rules, design guidelines and material selection for substrates, PTH vias, printed board assembly, laminate or ceramic materials, design for manufacturability
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Show Secondary and Basic Areas of Expertise | Localities:
Expert may consult nationally and internationally, and is also local to the following cities: Los Angeles, California;
San Diego, California;
Long Beach, California;
Santa Ana, California;
Anaheim, California;
Riverside, California;
Glendale, California;
Huntington Beach, California;
San Bernardino, California;
and Chula Vista, California.
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Degree |
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Subject |
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Institution |
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1992
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PhD
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Electrical Engineering
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Technical University of Berlin
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1986
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MSEE
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Electrical Engineering
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Technical University of Berlin
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Employer |
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Department |
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Title |
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Responsibilities |
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2006 to
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(Undisclosed Consulting Company)
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(Undisclosed Consulting Company)
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·Independent Consulting in IC Packaging design and development, Electrical Analysis
·Material selection for Packaging Materials, including Substrates, Die Adhesives, Encapsulation, Interconnection
·Vendor sourcing and interaction for product development
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2004 to 2006
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Meggitt Electronics Endevco
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Systems Engineering
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Project Engineering Manager
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·She managed the development team including packaging, materials, electrical, mechanical, and software engineers
·She coordinated and led product development within Stage Gate Process, troubleshooting, and testing of new systems for smart sensors, MEMs, MOEMs using Six Sigma/DOE principles
·Ensured proper transition of new products to Integration and Manufacturing Engineering
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1999 to 2004
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Conexant Systems Inc.
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IC Packaging and Assembly
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Principal Packaging Engineer
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·Managed several projects with cross-functional teams from IC design to package manufacturing, test and reliability to achieve cost reduction on wafer and package level and improve the technology.
·Developed design guidelines and product package roadmaps, aligning business needs with technical advancements
·Assessed emerging technologies (Flip Chip, stacked die, scribe line reduction).
·Developed new packages introducing new product design rules for the company's next generation of RF-IC products (e.g. world's smallest Power Amplifiers, LNAs, and Bluetooth). Worked closely with substrate and assembly manufacturers and cross-functional teams
·Performed electrical analysis of IC packages in Simultaneous switching noise, IBIS modeling, and parasitic analysis
·Reviewed package layouts for all advanced packages from Leadframe, RF-LGA and Multichip Modules to high I/O Ball Grid Array.
·Consulted different divisions for package selection, product design and design analysis prior to and post layout, input on cost, material and technology, gave workshops on Advance Packaging technologies
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1995 to 1999
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FRAUNHOFER INSTITUTE IN BERLIN – GERMANY
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Multichip Modules
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Head of Department
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Managed a group of 19 scientists/engineers. Led projects within Package Design, RF modeling and simulation, EMC/EMI analysis, HF measurement and test, and software development. Coordinated the priorities, schedules and budgets for the Research and Engineering.
Worked in research and development of advanced IC packages.
·Used Ansoft HFSS, Q3D/Q2D, PSPICE/HSPICE.
·Authored numerous chapters in the books: Direct Attachment of ICs (German, Editor Prof. Reichl) and EMC Cookbook for PCBs (German).
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1987 to 1994
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Technical University of Berlin
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Microperipherik
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Research Associate
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Worked towards PH.D in Package Electrical Analysis, wrote a software program to support package design and SI analysis.
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Publications and Patents Summary
Over 35 scientific publications and contributions to international conferences on High Speed Packages and related areas
·Several chapters in Books:
-Electromagnetic Compatibility EMC-Cookbook for PCBs (German) and in
-Direct Attachment of Integrated Circuits (German, Editor Prof. Reichl)
·Chairman of workshop “ Introduction to MCM and MCM design” (Nov 98 and Feb 99)
·Organization and presentation of several seminars on Signal Integrity, MCM and Advanced Package Technologies
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Recent Client Requests:
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Package substrate design expert for consulting on package and substrate design.
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Expert in design critea for electronics made on ceramic substrate.
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Expert for consulting on Soleniod Valve project has encountered problems.
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Expert in Carbon Ink Printed Circuit Boards.
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Expert in circuit board developer for consulting on fireplace.
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Click the green button above to contact
Expert for a free initial screening call regarding your expert consulting needs.
Expert is available for consulting to corporate, legal and government clients.
Remember, your initial screening call to speak with
Expert is free.
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Click the green button above to contact
Expert for a free initial screening call regarding expert testimony,
litigation consulting and support, forensic services, or any related expert witness services.
A few litigation needs include product liability, personal injury, economic loss, intellectual property
(patent, trademark, trade secret, copyright), and insurance matters. Remember, your initial screening
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Expert is free.
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| International Experience: |
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Country / Region |
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Summary |
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1987 to 1999
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Berlin/Germany
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Expert worked in different positions at the Technical University and at the Fraunhofer Institute for packaging research and development
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| Language Skills: |
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| Foreign Language |
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Description |
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German
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She speaks fluent in German
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Turkish
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She speaks fluent Turkish
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| Additional Skills and Services: |
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Training/Seminars
·She organized and presented several seminars on Signal Integrity, MCM and Advanced Package Technologies
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Supplier and Vendor Location and Selection She has experience in locating package substrate manufacturers, package assembly vendors
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Education
