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Expert in Soldering, Cleaning, Surface Mounting, PCBs
Available for your Consulting and Expert Witness Needs
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Summary of Expertise:
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Expert has expertise in all aspects of soldering. His knowledge originally developed during his six years as Staff Metallurgist at IBM, where he was in charge of soldering and metal joining for the product development labs. As Director of Research at a solder and flux manufacturer (Alpha Metals), Expert spent 12 years developing solder alloys, fluxes, cleaners, and other soldering chemicals. Since 1975, he has served the electronics industry as a consultant in this field. He holds several patents related to soldering. Expert's first book (1964) was entitled "Solders and Soldering." The book's third edition was published in 1992 and has been translated into Russian.
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Expert maintains that mechanical contacts, brazing, and welding are a part of metal joining and a comprehensive knowledge is needed to understand soldering and its intricacies. These aspects relate to the metallurgy of the interphase, its long term stability, the value of electroplating, and much more.
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Expert is one of the pioneers in applying the concept of solder paste to the electronics industry. He formulated his first pastes in 1962 for surface mounting in the hybrid industry. His efforts on behalf of Alpha Metals made them one of the undisputed worldwide leaders in this field. His involvement in customer service in the early years, and with paste in recent years, gives him a thorough understanding of the dispensing and reflow processes. He is knowledgeable of designing pastes for use in surface mounting, the details of printing the paste, setting up reflow profiles, and reviewing the quality and reliability of the joints. Chapters on solder pastes appear in both of Expert's books (see Selected Publications).
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This is a major portion of Expert's second book, "Soldering Handbook for Printed Circuits and Surface Mounting." A thorough understanding of this technology branch was needed for the development of soldering materials and process support. He consulted with equipment manufacturers, such as Hollis Automation, in the design and application of their equipment.
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Expert believes that the quality of a solder joint depends on the proficiency of an organization to select materials, design, layout, plan the process, and produce a quality board. These aspects are known to Expert and explained in his book. It covers both the older plated through-hole technology and the newer area of surface mounting. Expert has a large number of PCB fabricators in his clientele and is involved in all aspects of PCB fabrication. This includes drilling, plating, fusing, HAL, surface treatment, quality analysis, solder mask application, and others. He is often used as a liaison between fabricator and user, helping generate meaningful specifications and test standards for such parameters as solderability, PTH quality, measling, delamination, webbing, discoloration, warpage, and other areas.
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As described in his handbook, Expert gets involved with incoming material specification and inspection. From there he follows through with proper storage, kiting, component pre-prep, automatic insertion, manual stuffing and others. This includes placement of adhesive, wave soldering, solder paste printing, pick-and-place, and reflow. He says these are vital parts of assuring that the soldering process is reliable. These subjects were always an integral part of Expert's lectures and seminars.
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Expert helped pioneer water washing and solvent cleaning in the PCB industry in the early 1960s. This work did not limit itself to flux removal but included research of clean rooms and related areas. Both of Expert's books include a comprehensive treatment of cleaning materials and processes. He is involved in effluent control, solvent replacement, and water treatment. Expert was a pioneer in the no-clean philosophy, even before the present no-clean fluxes were introduced. His efforts in the 1960s included the use of rosin fluxes which were left on the surfaces. He has helped many clients convert to low-residue, no-clean fluxes. He is also working with VOC-free fluxes.
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Expert was involved in cleaning material development and the design of cleaning equipment and methods. His involvement with cleaning goes beyond flux removal, and extends to mechanical and electronic assemblies in process operations like plating, organic coatings, and others. He has been involved with cleanliness testing and specifications.
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Expert was introduced to surface mount technology very early in hybrid development at IBM and followed it through to the present day. His second book reveals his breadth of knowledge in this field. Expert has helped clients to convert to surface mounting and achieve less than 100 ppm first time reject rates. He can answer in-depth questions on surface mount cleaning and soldering issues.
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Involved in all aspects of this technology, Expert has advised clients who make leadframes and manufacture the tape assemblies. He is familiar with inner lead bonding (ILB) and outer lead bonding (OLB). He is experienced with COB assemblies with flip-chip and stitch bonding.
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Expert is involved with all aspects of this high-density I/O packaging technology, which uses solder balls in the surface mounting process. He is familiar with bumping, placement, reflowing, and rework techniques.
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Much of Expert's activity involves failure analysis of first time pass assemblies and assemblies in the field. Much of this work is explained in his book on soldering.
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Expert has often consulted on corrosion problems that are usually attributed to flux residues. While properly removed flux is seldom the cause, Expert's knowledge of plating, cleaning, and other processes used in electronic assembly has helped him identify the real causes.
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Expert studied the wetting mechanism in great detail while at IBM and published some of the results in the paper "Mechanism of Wetting During Solder Joint Formation" (ASTM 65th Annual Meeting, June 1962). The discussion on wetting was expanded for the two books published by McGraw-Hill and Van Nostrand Reinhold. He published an additional paper on the importance of solderability in electroplating, namely "Solderability A Prerequisite to Tin-Lead Plating" (Plating, July 1967).
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His work on solderability includes participating in the writing of the EIA-RS-178 Solderability Specification (Electronic Industry Association) as well as chairing the committee that wrote the first IPC solderability test (IPC-STD-801), for which he received the Association's Presidents Award in 1966. Expert also served for 11 years as the U.S.A. Technical Expert on the International Solderability Work Group of the International Electrotechnical Commission (IEC). He is still a corresponding member of that work group. He published several papers on solderability and solderability testing.
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Expert believes there cannot be universal standards to cover the entire range of the soldering industry. Space or military standards are not suitable for industrial or commercial assemblies. He has written detailed workmanship standards for such diverse companies as Raytheon, IBM, RCA, Sylvania, Allan Bradley, Apple Computer, Motorola, and many more. He has set up training programs for these and many other companies.
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Show Secondary and Basic Areas of Expertise | Localities:
Expert may consult nationally and internationally, and is also local to the following cities: New York, New York;
Yonkers, New York;
Newark, New Jersey;
Jersey City, New Jersey;
Paterson, New Jersey;
Elizabeth, New Jersey;
Bridgeport, Connecticut;
New Haven, Connecticut;
Hartford, Connecticut;
and Philadelphia, Pennsylvania.
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Degree |
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Subject |
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Institution |
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1974
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MBA
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Marketing & International Business
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Fairleigh Dickinson University
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1962
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MS
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Metallurgy
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New York University
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1953
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BS
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Chemical Engineering
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Technion University
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Employer |
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Title |
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1975 to
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(Undisclosed)
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President & Consultant
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1962 to 1975
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Alpha Metals
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Director of Research and Development
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1962 to 1975
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Alphamel International
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Vice President
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1951 to 1962
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Metal Joining, IBM
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Staff Engineer
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Associations/Societies
Expert is a member of the IEC Work Group on Solderability. He is also a member of IEEE, ASM, AIME, ISHM, and IEP.
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Licenses/Certifications
Expert received the President's Award in 1966 from the IPC.
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Awards/Recognition
Expert has authored two books and over 75 articles in trade journals and magazines.
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Publications and Patents Summary
Expert has authored two books and over 75 articles in trade journals and magazines.
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Selected Publications and Publishers
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- Van Nostrand Reinhold Co.
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- McGraw-Hill Book Co.
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Recent Client Requests:
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Expert in component assembly guidelines for consulting on footprint, assembly and cleaning guidelines for SMT.
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Expert in electronic component manufacturing for consulting on Failure Analysis.
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Laser soldering expert for consulting on designs and process for selective laser soldering applications and appropriate testing.
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Soldering expert for consulting on solderability of gold leads after long term storage.
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Solder flux expert for consulting on solder flux residue characterization and control.
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Refractory metal expert for consulting on refractory metal issues.
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Wave solder expert for consulting on icicle prevention in wave flow solder tinning process.
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Soldering expert for consulting on wave soldering of electronic thru hole components.
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Soldering expert for consulting on soldering for cable lead to silver frit on glass.
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Expert in lead tinning for consulting on root cause and eliminate the occurrence of excess solder build up.
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Expert for consulting on Die attach of Bipolar Transistor using AuSn versus AuSi.
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Expert in Carbon Ink Printed Circuit Boards.
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Expert in IST coupon correlation, PWB reliability issues (dewetting, ionic contamination, electro-chemical migration).
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Expert in solder joint analysis for evaluation of several failed solder joints on a test printed circuit board.
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Expert in PCBs for consulting on recommending some areas of focus for solder process improvement.
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Click the green button above to contact
Expert for a free initial screening call regarding your expert consulting needs.
Expert is available for consulting to corporate, legal and government clients.
Remember, your initial screening call to speak with
Expert is free.
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Recent Litigation Client Requests:
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Soulder joint / substrate failure expert needed for consulting regarding a Soulder joint / substrate failure.
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Expert circuit boards manufacturer arizona for consulting on opinion.
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Solder manufacturing expert for consulting on solder and flux manufacture.
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Expert in soldering for consulting on attaching components to laminate boards.
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Click the green button above to contact
Expert for a free initial screening call regarding expert testimony,
litigation consulting and support, forensic services, or any related expert witness services.
A few litigation needs include product liability, personal injury, economic loss, intellectual property
(patent, trademark, trade secret, copyright), and insurance matters. Remember, your initial screening
call to speak with
Expert is free.
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| Additional Skills and Services: |
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Supplier and Vendor Location and Selection Expert has experience locating vendors of soldering materials, solder related equipment, cleaning materials, cleaning related equipment, and soldering related test equipment. Expert also has access to printed materials (catalogs), and personal contacts.
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Other Skills and Services
Expert has consulted and lectured extensively at universities, conventions, and in industry, both nationally and internationally.
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Education
